JPS63191664U - - Google Patents
Info
- Publication number
- JPS63191664U JPS63191664U JP8279687U JP8279687U JPS63191664U JP S63191664 U JPS63191664 U JP S63191664U JP 8279687 U JP8279687 U JP 8279687U JP 8279687 U JP8279687 U JP 8279687U JP S63191664 U JPS63191664 U JP S63191664U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- plate
- attaching
- holes
- binder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011230 binding agent Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8279687U JPH056679Y2 (en]) | 1987-05-29 | 1987-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8279687U JPH056679Y2 (en]) | 1987-05-29 | 1987-05-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63191664U true JPS63191664U (en]) | 1988-12-09 |
| JPH056679Y2 JPH056679Y2 (en]) | 1993-02-19 |
Family
ID=30935776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8279687U Expired - Lifetime JPH056679Y2 (en]) | 1987-05-29 | 1987-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH056679Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013157533A (ja) * | 2012-01-31 | 2013-08-15 | Kyocera Corp | セラミック配線基板、半導体素子実装基板、半導体装置 |
-
1987
- 1987-05-29 JP JP8279687U patent/JPH056679Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013157533A (ja) * | 2012-01-31 | 2013-08-15 | Kyocera Corp | セラミック配線基板、半導体素子実装基板、半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH056679Y2 (en]) | 1993-02-19 |